Spice中的系统级Esd仿真:一种整体方法

2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) Pub Date : 2018-09-01 DOI:10.23919/EOS/ESD.2018.8509784

Y. Zhou, J. Hajjar, S. Parthasarathy, D. Clarke, Brian Moane

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引用次数: 1

摘要

在产品层面遵从系统级ESD健壮性正日益成为一种竞争优势。在制造之前预测设计的分类测试水平对于实现首次通过的成功至关重要，同时也解决了这方面的关键问题。紧凑的模型和仿真平台已经开发，以预测系统级ESD稳健性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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System Level Esd Simulation In Spice: A Holistic Approach

Compliance to system-level ESD robustness at the product level is increasingly becoming a competitive advantage. Predicting the classification test level of a design prior to fabrication is critical in achieving first pass success and also addressing key concerns in this regards. Compact models and a simulation platform have been developed to predict system-level ESD robustness.

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2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)

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