{"title":"液氮CMOS系统研究","authors":"D. Meyer","doi":"10.1109/LTSE.1989.50172","DOIUrl":null,"url":null,"abstract":"In a liquid-nitrogen CMOS (LNCMOS) study, all major technical areas of interest were investigated including: device design and modeling, circuit design, process design, packaging, reliability, testing, refrigeration systems, system applications, and performance. In each of these areas, physical hardware was evaluated to determine the actual advantages. Three IBM CMOS technologies were evaluated to determine relative system performance improvements: 1.0- mu m n-well CMOS, n/sup +/ polysilicon, 5-V operation; 0.5- mu m n-well CMOS, n/sup +/ polysilicon with silicide on polysilicon and diffusions (salicide), 3.3-V operation; and 0.5- mu m n-well CMOS (LNCMOS), n/sup +/ silicide on nFET and p/sup +/ silicide on pFET, threshold voltage implant optimization, 2.5-V operation. These three CMOS technologies are closely related to each other by scaling and the LNCMOS process is an optimization of the 0.5- mu m CMOS process. It is concluded that LNCMOS is a viable system technology for military and commercial systems.<<ETX>>","PeriodicalId":428125,"journal":{"name":"Proceedings of the Workshop on Low Temperature Semiconductor Electronics,","volume":"88 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Liquid nitrogen CMOS system study\",\"authors\":\"D. Meyer\",\"doi\":\"10.1109/LTSE.1989.50172\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In a liquid-nitrogen CMOS (LNCMOS) study, all major technical areas of interest were investigated including: device design and modeling, circuit design, process design, packaging, reliability, testing, refrigeration systems, system applications, and performance. In each of these areas, physical hardware was evaluated to determine the actual advantages. Three IBM CMOS technologies were evaluated to determine relative system performance improvements: 1.0- mu m n-well CMOS, n/sup +/ polysilicon, 5-V operation; 0.5- mu m n-well CMOS, n/sup +/ polysilicon with silicide on polysilicon and diffusions (salicide), 3.3-V operation; and 0.5- mu m n-well CMOS (LNCMOS), n/sup +/ silicide on nFET and p/sup +/ silicide on pFET, threshold voltage implant optimization, 2.5-V operation. These three CMOS technologies are closely related to each other by scaling and the LNCMOS process is an optimization of the 0.5- mu m CMOS process. It is concluded that LNCMOS is a viable system technology for military and commercial systems.<<ETX>>\",\"PeriodicalId\":428125,\"journal\":{\"name\":\"Proceedings of the Workshop on Low Temperature Semiconductor Electronics,\",\"volume\":\"88 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the Workshop on Low Temperature Semiconductor Electronics,\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LTSE.1989.50172\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the Workshop on Low Temperature Semiconductor Electronics,","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LTSE.1989.50172","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
摘要
在一项液氮CMOS (LNCMOS)研究中,研究了所有主要的技术领域,包括:器件设计和建模、电路设计、工艺设计、封装、可靠性、测试、制冷系统、系统应用和性能。在这些领域中,对物理硬件进行了评估,以确定实际优势。评估了三种IBM CMOS技术,以确定相对的系统性能改进:1.0 μ m n阱CMOS, n/sup +/多晶硅,5 v操作;0.5 μ m n阱CMOS, n/sup +/多晶硅,多晶硅上有硅化物和扩散物(水杨酸),3.3 v工作;和0.5 μ m n阱CMOS (LNCMOS), nFET上n/sup +/硅化物和pFET上p/sup +/硅化物,阈值电压植入优化,2.5 v工作。这三种CMOS技术通过缩放密切相关,LNCMOS工艺是对0.5 μ m CMOS工艺的优化。得出结论,LNCMOS是一种可行的军事和商业系统技术。
In a liquid-nitrogen CMOS (LNCMOS) study, all major technical areas of interest were investigated including: device design and modeling, circuit design, process design, packaging, reliability, testing, refrigeration systems, system applications, and performance. In each of these areas, physical hardware was evaluated to determine the actual advantages. Three IBM CMOS technologies were evaluated to determine relative system performance improvements: 1.0- mu m n-well CMOS, n/sup +/ polysilicon, 5-V operation; 0.5- mu m n-well CMOS, n/sup +/ polysilicon with silicide on polysilicon and diffusions (salicide), 3.3-V operation; and 0.5- mu m n-well CMOS (LNCMOS), n/sup +/ silicide on nFET and p/sup +/ silicide on pFET, threshold voltage implant optimization, 2.5-V operation. These three CMOS technologies are closely related to each other by scaling and the LNCMOS process is an optimization of the 0.5- mu m CMOS process. It is concluded that LNCMOS is a viable system technology for military and commercial systems.<>