cmos90176引线LQFP 24×24mm封装模具化合物选择研究

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2012-11-01 DOI:10.1109/IEMT.2012.6521769

Teng Seng Kiong, I. Ruzaini, S. Hian

{"title":"cmos90176引线LQFP 24×24mm封装模具化合物选择研究","authors":"Teng Seng Kiong, I. Ruzaini, S. Hian","doi":"10.1109/IEMT.2012.6521769","DOIUrl":null,"url":null,"abstract":"Semiconductor chip packages is getting more challenging nowadays with increase of I/O and lead counts, especially for thin and large body packages such as LQFP (Low Profile Quad Flat Packages) and TQFP (Thin Quad Flat Packages). Material selection for such package especially for automotive product is a key for qualification success and long term package reliability to meet industry requirement. This paper presents mold compound selection and development works done with several mold compound candidates from different mold compound suppliers, which include screening of candidates based on assembly output response, package reliability stress study as well as molding parameters optimization and establishment for selected mold compound for CMOS90 176 lead LQFP 24×24mm package. Mold compound properties of each compound candidate were studied.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Mold compound selection study for CMOS90 176 lead LQFP 24×24mm package\",\"authors\":\"Teng Seng Kiong, I. Ruzaini, S. Hian\",\"doi\":\"10.1109/IEMT.2012.6521769\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Semiconductor chip packages is getting more challenging nowadays with increase of I/O and lead counts, especially for thin and large body packages such as LQFP (Low Profile Quad Flat Packages) and TQFP (Thin Quad Flat Packages). Material selection for such package especially for automotive product is a key for qualification success and long term package reliability to meet industry requirement. This paper presents mold compound selection and development works done with several mold compound candidates from different mold compound suppliers, which include screening of candidates based on assembly output response, package reliability stress study as well as molding parameters optimization and establishment for selected mold compound for CMOS90 176 lead LQFP 24×24mm package. Mold compound properties of each compound candidate were studied.\",\"PeriodicalId\":315408,\"journal\":{\"name\":\"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.2012.6521769\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2012.6521769","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

随着I/O和引线数量的增加，半导体芯片封装正变得越来越具有挑战性，特别是对于像LQFP (Low Profile Quad Flat封装)和TQFP (thin Quad Flat封装)这样的薄体和大体封装。特别是汽车产品包装的材料选择是合格与否和长期可靠性满足行业要求的关键。本文介绍了针对cmos90176 lead LQFP 24×24mm封装的几种候选模具化合物的选择和开发工作，包括基于装配输出响应的候选模具化合物筛选、封装可靠性应力研究以及成型参数优化和所选模具化合物的建立。研究了每种候选化合物的模具化合物性能。

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Mold compound selection study for CMOS90 176 lead LQFP 24×24mm package

Semiconductor chip packages is getting more challenging nowadays with increase of I/O and lead counts, especially for thin and large body packages such as LQFP (Low Profile Quad Flat Packages) and TQFP (Thin Quad Flat Packages). Material selection for such package especially for automotive product is a key for qualification success and long term package reliability to meet industry requirement. This paper presents mold compound selection and development works done with several mold compound candidates from different mold compound suppliers, which include screening of candidates based on assembly output response, package reliability stress study as well as molding parameters optimization and establishment for selected mold compound for CMOS90 176 lead LQFP 24×24mm package. Mold compound properties of each compound candidate were studied.

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来源期刊

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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