创新实践环节7C:混合信号测试与调试

S. Natarajan
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引用次数: 0

摘要

传统的测试工作重点是大批量制造测试的创新和效率。然而,在现实中,在认为模拟和高速串行IO测试刺激内容制作有价值之前,大量的工作花费在设计验证和调试上。在这次演讲中,我们强调了扩大后硅封装的重要性,除了制造测试之外,还包括早期设计验证和调试。考虑到对DFX架构的影响,为了提高效率,架构必须在更广泛的后硅阶段中进行扩展。我们还讨论了在设计验证和制造测试测量之间建立快速关联的必要性,以及它为基本上基于数字工艺技术设计的模拟和IO内容带来的上市时间节省。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Innovative practices session 7C: Mixed signal test and debug
The traditional focus of work in test has been innovation and efficiency for high volume manufacturing test. However, in reality, a significant amount of effort is expended on design validation and debug prior to deeming analog and high speed serial IO test stimuli content production worthy. In this presentation we emphasize the importance of widening the post-silicon envelope to include early design validation and debug in addition to manufacturing test. The impact on DFX architecture is considered in which in order to be efficient the architecture has to be scalable across a wider set of post-silicon stages. We also discuss the need for establishing quick correlation between design validation and manufacturing test measurements and the time-to-market savings it brings for analog and IO content designed essentially on a digital process technology.
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