采用双电阻紧凑型LED模型的大功率LED系统热仿真分析

Z. Ong, S. Subramani, M. Devarajan
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引用次数: 6

摘要

本文采用仿真和实验方法对大功率LED系统进行了热分析和验证。将3W大功率LED封装安装在MCPCB和散热器上,在具有三种不同正向电流的(300 × 300 × 300mm)静气室中进行测试。利用热瞬态测试仪(T3Ster)进行了实验测量,以捕捉LED系统的热瞬态特性。采用FloEFD 12.1 CFD软件进行仿真,采用双电阻模型定义了不同正向电流下LED封装的热阻。从验证结果来看,仿真结果与实验结果吻合较好,最大误差百分比为4.75%。仿真中还对系统周围空气温度进行了研究。在验证之后,对带矩形夹具和不带矩形夹具的LED系统进行了仿真和比较。不加夹具的模型热学效果较好。流动轨迹图显示了有夹具和没有夹具时空气对流的差异。仿真结果表明,夹具破坏了室内的自然对流。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal simulation analysis of high power LED system using two-resistor compact LED model
This paper presents the thermal analysis and validation of high power LED system with simulation and experimental methods. A 3W high power LED package is mounted on MCPCB and heat sink, which is tested inside a (300 × 300 × 300mm) still air chamber with three different forward currents. Experimental measurement with Thermal Transient Tester (T3Ster) is performed to capture the thermal transient characteristic of the LED system. The simulation is conducted with FloEFD 12.1 CFD software, using two-resistor model the LED package is defined with thermal resistance at different forward current. From the validation the simulation result closely match the experimental result, with highest percentage error at 4.75%. The surrounding air temperature of the system is also studied in the simulation. Following the verification, LED system with and without rectangular fixture are simulated and compared. The model without fixture shows better thermal results. The flow trajectory plot shows the difference in air convection with and without fixture. The simulation shows fixture disrupts the natural convection in the chamber.
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