用于低温直接键合技术的3D集成应用

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 1900-01-01 DOI:10.1109/ltb-3d.2014.6886147

P. Enquist

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引用次数: 1

摘要

本文介绍了低温直接键合技术及其应用。该技术包括ZiBond®和DBI®混合键合。支持的应用包括背面照明(BSI)图像传感器;叠置BSI图像传感器;DBI®混合键合图像传感器;3 d记忆;更高性能、更低成本的射频前端;并且减少了厚度，降低了模具堆的成本，降低了应力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3D integration applications for low temperature direct bond technology

This paper describes low temperature direct bond technology and applications enabled by this technology. This technology includes ZiBond® and DBI® hybrid bonding. Enabled applications include backside illuminated (BSI) image sensors; stacked BSI image sensors; DBI® hybrid bond image sensors; 3D memory; higher performance, lower cost RF front ends; and reduced thickness, lower cost die stacks with reduced stress.

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来源期刊

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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