优化电子外壳设计的热和湿度管理使用校准模型的渐进复杂性

S. Mohanty, Z. Staliulionis, P. S. Nasirabadi, R. Ambat, J. Hattel
{"title":"优化电子外壳设计的热和湿度管理使用校准模型的渐进复杂性","authors":"S. Mohanty, Z. Staliulionis, P. S. Nasirabadi, R. Ambat, J. Hattel","doi":"10.1109/EPTC.2016.7861525","DOIUrl":null,"url":null,"abstract":"The thermal and moisture management of electronic enclosures are fields of high interest in recent years. It is now generally accepted that the protection of electronic devices is dependent on avoiding critical levels of relative humidity (typically 60–90%) during operations. Leveraging the development of rigorous calibrated CFD models as well as simple predictive numerical tools, the current paper tackles the optimization of critical features of a typical two-chamber electronic enclosure. The progressive optimization strategy begins the design parameter selection by initially using simpler equivalent RC-circuit models for concentration of water vapor and temperature in the electronic enclosure. After reducing the potential parameter-value space for the critical features using the RC-approach, the optimization strategy uses simpler 2D CFD models of temperature and moisture transport to further focus the parameter-value space, before shifting to 3D CFD models for final evaluations and verification. The approach results in a system capable of predicting optimum design features for the thermal and moisture management of electronic enclosures in a time-efficient and practically implementable manner.","PeriodicalId":136525,"journal":{"name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optimization of electronic enclosure design for thermal and moisture management using calibrated models of progressive complexity\",\"authors\":\"S. Mohanty, Z. Staliulionis, P. S. Nasirabadi, R. Ambat, J. Hattel\",\"doi\":\"10.1109/EPTC.2016.7861525\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The thermal and moisture management of electronic enclosures are fields of high interest in recent years. It is now generally accepted that the protection of electronic devices is dependent on avoiding critical levels of relative humidity (typically 60–90%) during operations. Leveraging the development of rigorous calibrated CFD models as well as simple predictive numerical tools, the current paper tackles the optimization of critical features of a typical two-chamber electronic enclosure. The progressive optimization strategy begins the design parameter selection by initially using simpler equivalent RC-circuit models for concentration of water vapor and temperature in the electronic enclosure. After reducing the potential parameter-value space for the critical features using the RC-approach, the optimization strategy uses simpler 2D CFD models of temperature and moisture transport to further focus the parameter-value space, before shifting to 3D CFD models for final evaluations and verification. The approach results in a system capable of predicting optimum design features for the thermal and moisture management of electronic enclosures in a time-efficient and practically implementable manner.\",\"PeriodicalId\":136525,\"journal\":{\"name\":\"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"51 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2016.7861525\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2016.7861525","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

电子外壳的热湿管理是近年来备受关注的领域。现在人们普遍认为,电子设备的保护取决于在操作过程中避免临界相对湿度水平(通常为60-90%)。利用严格校准的CFD模型以及简单的预测数值工具的发展,本文解决了典型双腔电子外壳关键特征的优化问题。渐进式优化策略从设计参数选择开始,最初使用更简单的等效rc电路模型来计算电子外壳内的水蒸气浓度和温度。在使用rc方法减少关键特征的潜在参数值空间后,优化策略使用更简单的二维CFD温度和水分输运模型来进一步集中参数值空间,然后转向三维CFD模型进行最终评估和验证。该方法产生了一个系统,能够以高效和实际可实施的方式预测电子外壳的热湿管理的最佳设计特征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimization of electronic enclosure design for thermal and moisture management using calibrated models of progressive complexity
The thermal and moisture management of electronic enclosures are fields of high interest in recent years. It is now generally accepted that the protection of electronic devices is dependent on avoiding critical levels of relative humidity (typically 60–90%) during operations. Leveraging the development of rigorous calibrated CFD models as well as simple predictive numerical tools, the current paper tackles the optimization of critical features of a typical two-chamber electronic enclosure. The progressive optimization strategy begins the design parameter selection by initially using simpler equivalent RC-circuit models for concentration of water vapor and temperature in the electronic enclosure. After reducing the potential parameter-value space for the critical features using the RC-approach, the optimization strategy uses simpler 2D CFD models of temperature and moisture transport to further focus the parameter-value space, before shifting to 3D CFD models for final evaluations and verification. The approach results in a system capable of predicting optimum design features for the thermal and moisture management of electronic enclosures in a time-efficient and practically implementable manner.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信