{"title":"封装测试接口夹具考虑低成本解决方案，高电气性能，并与小间距封装兼容","authors":"Ki-Jae Song, Hunkyo Seo, Sang-hyun Ko","doi":"10.1109/TEST.2010.5699264","DOIUrl":null,"url":null,"abstract":"This paper introduces the package test interface fixture with low cost test topology, high electrical performances, and compatibility with fine pitch packages. The proposed fixture demonstrates electrical performance using special jig and mobile DDR2.","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"222 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Package test interface fixture considering low cost solution, high electrical performance, and compatibility with fine pitch packages\",\"authors\":\"Ki-Jae Song, Hunkyo Seo, Sang-hyun Ko\",\"doi\":\"10.1109/TEST.2010.5699264\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper introduces the package test interface fixture with low cost test topology, high electrical performances, and compatibility with fine pitch packages. The proposed fixture demonstrates electrical performance using special jig and mobile DDR2.\",\"PeriodicalId\":265156,\"journal\":{\"name\":\"2010 IEEE International Test Conference\",\"volume\":\"222 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.2010.5699264\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.2010.5699264","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Package test interface fixture considering low cost solution, high electrical performance, and compatibility with fine pitch packages
This paper introduces the package test interface fixture with low cost test topology, high electrical performances, and compatibility with fine pitch packages. The proposed fixture demonstrates electrical performance using special jig and mobile DDR2.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
