热载流子在BiCMOS晶体管中诱导HFE降解

C.J. Varker, D. Pettengill, W. Shiau, B. Reuss
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引用次数: 8

摘要

本文介绍了一项研究的实验结果,该研究旨在了解BiCMOS npn晶体管中导致热载流子可靠性降低的物理机制和工艺输入。总体目标是在产品开发期间关联和提取工艺模块和器件设计的信息,并开发可靠性驱动规则,可用于减少正向电流增益的热载流子退化,并提高晶体管的整体可靠性。研究结果表明,在BiCMOS npn晶体管中,本然基底植入剂量、能量和热历史对热载子诱导的正向电流增益衰减有影响
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hot carrier induced HFE degradation in BiCMOS transistors
Experimental results are presented of an investigation designed to develop an understanding of the physical mechanisms and the process inputs causing reduced hot carrier reliability in BiCMOS npn transistors. The overall objective is to correlate and extract information on process module and device design during product development and to develop reliability-driven rules which can be used to reduce hot carrier degradation of the forward current gain and to improve overall transistor reliability. The results show the effects of the intrinsic base implant dose and energy as well as thermal history on hot-carrier-induced forward-current-gain degradation in BiCMOS npn transistors.<>
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