基于IEEE 1687集成嵌入式tap和IEEE 1500接口的AI SoC快速启动

Haiying Ma, Ligang Lu, Haitao Qian, Jing Han, Xin Wen, Fanjin Meng, Rahul Singhal, Martin Keim, Yu Huang, Wu Yang
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引用次数: 1

摘要

复杂的特定于应用的SoC正在为支持人工智能(AI)应用的硬件开发。这种复杂的soc集成了大量的片内和片外存储器,众多内核和接口,包括我们的嵌入式tap层次结构,以及安全措施和设计测试(DFT)结构。在这篇案例研究论文中,我们演示了使用IEEE 1687-2014 (IJTAG)将所有这些不同的组件集成到一个单一的统一方法中。由此,我们获得了工作流程效率和快速硅片生成的好处。例如,我们可以报告整个SoC的DFT的硅培养在大约4天内完成,并且SoC的其他培养方面也在很短的时间内完成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fast Bring-Up of an AI SoC through IEEE 1687 Integrating Embedded TAPs and IEEE 1500 Interfaces
Complex application specific SoC are being developed for hardware support artificial intelligence (AI) applications. Such a complex SoCs are integrating a large number of on-chip and off-chip memories, numerous cores and interfaces including in our case a hierarchy of embedded TAPs, as well as security measures and Design-For-Test (DFT) structures. In this case-study paper, we demonstrate using IEEE 1687-2014 (IJTAG) to integrate all these different components into a single, unifying methodology. From this, we derive the benefits of workflow efficiency and fast silicon bring-up. For example, we can report that silicon bring-up of the DFT of the entire SoC was completed in about 4 days, and other bring-up aspects of the Soc were also completed in very little time.
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