肖特基势垒二极管在90nm SiGe BiCMOS工艺工作近2.0太赫兹截止频率

V. Jain, P. Cheng, B. J. Gross, R. Camillo-Castillo, J. Pekarik, J. Adkisson, Qizhi Z. Liu, P. Gray, V. Kaushal, D. Harame, A. DiVergilio
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引用次数: 6

摘要

提出了一种将截止频率(fc) ~2.0 THz的高性能肖特基势垒二极管(sbd)集成到90nm SiGe BiCMOS技术中,用于毫米波应用。据我们所知,这是BiCMOS技术中SBD报道的最高fc。这里报道的sdd具有低的反向偏置泄漏,击穿电压为~5V,并且已经集成在基础技术中,而无需添加任何额外的处理步骤。关键工艺和器件参数的变化——未掺杂硅层(n-epi)厚度、与深沟槽形成相关的热循环、阴极通达宽度和阳极面积对器件性能的影响也进行了研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Schottky Barrier Diodes in 90nm SiGe BiCMOS process operating near 2.0 THz cut-off frequency
High performance Schottky Barrier Diodes (SBDs) with cut-off frequency (fc) ~2.0 THz integrated into a 90nm SiGe BiCMOS technology for millimeter wave (mm-wave) applications are presented in this paper. To our knowledge, this is the highest reported fc for a SBD in a BiCMOS technology. The SBDs reported here have low reverse bias leakage with breakdown voltage of ~5V, and have been integrated in the base technology without the addition of any extra processing step. The affects of variation of critical process and device parameters - undoped silicon layer (n-epi) thickness, thermal cycle associated with deep-trench formation, cathode reach-through width, and anode area on device performance have also been investigated and are presented here.
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