V. Jain, P. Cheng, B. J. Gross, R. Camillo-Castillo, J. Pekarik, J. Adkisson, Qizhi Z. Liu, P. Gray, V. Kaushal, D. Harame, A. DiVergilio
{"title":"肖特基势垒二极管在90nm SiGe BiCMOS工艺工作近2.0太赫兹截止频率","authors":"V. Jain, P. Cheng, B. J. Gross, R. Camillo-Castillo, J. Pekarik, J. Adkisson, Qizhi Z. Liu, P. Gray, V. Kaushal, D. Harame, A. DiVergilio","doi":"10.1109/BCTM.2013.6798147","DOIUrl":null,"url":null,"abstract":"High performance Schottky Barrier Diodes (SBDs) with cut-off frequency (fc) ~2.0 THz integrated into a 90nm SiGe BiCMOS technology for millimeter wave (mm-wave) applications are presented in this paper. To our knowledge, this is the highest reported fc for a SBD in a BiCMOS technology. The SBDs reported here have low reverse bias leakage with breakdown voltage of ~5V, and have been integrated in the base technology without the addition of any extra processing step. The affects of variation of critical process and device parameters - undoped silicon layer (n-epi) thickness, thermal cycle associated with deep-trench formation, cathode reach-through width, and anode area on device performance have also been investigated and are presented here.","PeriodicalId":272941,"journal":{"name":"2013 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Schottky Barrier Diodes in 90nm SiGe BiCMOS process operating near 2.0 THz cut-off frequency\",\"authors\":\"V. Jain, P. Cheng, B. J. Gross, R. Camillo-Castillo, J. Pekarik, J. Adkisson, Qizhi Z. Liu, P. Gray, V. Kaushal, D. Harame, A. DiVergilio\",\"doi\":\"10.1109/BCTM.2013.6798147\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High performance Schottky Barrier Diodes (SBDs) with cut-off frequency (fc) ~2.0 THz integrated into a 90nm SiGe BiCMOS technology for millimeter wave (mm-wave) applications are presented in this paper. To our knowledge, this is the highest reported fc for a SBD in a BiCMOS technology. The SBDs reported here have low reverse bias leakage with breakdown voltage of ~5V, and have been integrated in the base technology without the addition of any extra processing step. The affects of variation of critical process and device parameters - undoped silicon layer (n-epi) thickness, thermal cycle associated with deep-trench formation, cathode reach-through width, and anode area on device performance have also been investigated and are presented here.\",\"PeriodicalId\":272941,\"journal\":{\"name\":\"2013 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM)\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/BCTM.2013.6798147\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/BCTM.2013.6798147","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Schottky Barrier Diodes in 90nm SiGe BiCMOS process operating near 2.0 THz cut-off frequency
High performance Schottky Barrier Diodes (SBDs) with cut-off frequency (fc) ~2.0 THz integrated into a 90nm SiGe BiCMOS technology for millimeter wave (mm-wave) applications are presented in this paper. To our knowledge, this is the highest reported fc for a SBD in a BiCMOS technology. The SBDs reported here have low reverse bias leakage with breakdown voltage of ~5V, and have been integrated in the base technology without the addition of any extra processing step. The affects of variation of critical process and device parameters - undoped silicon layer (n-epi) thickness, thermal cycle associated with deep-trench formation, cathode reach-through width, and anode area on device performance have also been investigated and are presented here.