ICB沉积银/硅肖特基结构的温度相关I-V特性分析

D. Korosak, B. Cvikl
{"title":"ICB沉积银/硅肖特基结构的温度相关I-V特性分析","authors":"D. Korosak, B. Cvikl","doi":"10.1109/ASDAM.1998.730184","DOIUrl":null,"url":null,"abstract":"The current-voltage characteristics of Ionized Cluster Beam (ICB) deposited Ag/n-Si Schottky structures for nonzero acceleration voltage U/sub g/=300 V, 1 kV measured in the temperature interval T/spl isin/[300 K, 150 K] are analysed in order to identify possible different charge transport mechanisms on the samples. In the high temperature interval the charge transport is well enough described within the thermionic emission theory framework (TE), whereas in the low temperature interval (T<200 K) the suitable description of the transport is obtained assuming conduction through deep impurity levels and hopping process between continuously destructed localized electron states in the silicon band gap. It is argued that the addition transport mechanisms are induced by the disordered interfacial control layer (DICL) form by the energetic Ag ion incorporated into silicon crystal lattice situated between the metal and the ordered part of the semiconductor.","PeriodicalId":378441,"journal":{"name":"ASDAM '98. Conference Proceedings. Second International Conference on Advanced Semiconductor Devices and Microsystems (Cat. No.98EX172)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Analysis of the temperature dependent I-V characteristics of the ICB deposited Ag/Si Schottky structures\",\"authors\":\"D. Korosak, B. Cvikl\",\"doi\":\"10.1109/ASDAM.1998.730184\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The current-voltage characteristics of Ionized Cluster Beam (ICB) deposited Ag/n-Si Schottky structures for nonzero acceleration voltage U/sub g/=300 V, 1 kV measured in the temperature interval T/spl isin/[300 K, 150 K] are analysed in order to identify possible different charge transport mechanisms on the samples. In the high temperature interval the charge transport is well enough described within the thermionic emission theory framework (TE), whereas in the low temperature interval (T<200 K) the suitable description of the transport is obtained assuming conduction through deep impurity levels and hopping process between continuously destructed localized electron states in the silicon band gap. It is argued that the addition transport mechanisms are induced by the disordered interfacial control layer (DICL) form by the energetic Ag ion incorporated into silicon crystal lattice situated between the metal and the ordered part of the semiconductor.\",\"PeriodicalId\":378441,\"journal\":{\"name\":\"ASDAM '98. Conference Proceedings. Second International Conference on Advanced Semiconductor Devices and Microsystems (Cat. No.98EX172)\",\"volume\":\"49 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-10-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ASDAM '98. Conference Proceedings. Second International Conference on Advanced Semiconductor Devices and Microsystems (Cat. No.98EX172)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASDAM.1998.730184\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ASDAM '98. Conference Proceedings. Second International Conference on Advanced Semiconductor Devices and Microsystems (Cat. No.98EX172)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASDAM.1998.730184","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在温度区间T/spl /[300 K, 150 K]测量非零加速电压U/sub /=300 V, 1 kV时,分析了电离簇束(ICB)沉积Ag/n-Si肖特基结构的电流-电压特性,以确定样品上可能存在的不同电荷输运机制。在高温区间,电荷输运在热离子发射理论框架(TE)内得到了很好的描述,而在低温区间(T<200 K),电荷输运得到了合适的描述,假设通过深杂质水平传导和硅带隙中连续破坏的局域电子态之间的跳变过程。本文认为,附加输运机制是由高能银离子结合到位于金属和半导体有序部分之间的硅晶格中形成的无序界面控制层(DICL)引起的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis of the temperature dependent I-V characteristics of the ICB deposited Ag/Si Schottky structures
The current-voltage characteristics of Ionized Cluster Beam (ICB) deposited Ag/n-Si Schottky structures for nonzero acceleration voltage U/sub g/=300 V, 1 kV measured in the temperature interval T/spl isin/[300 K, 150 K] are analysed in order to identify possible different charge transport mechanisms on the samples. In the high temperature interval the charge transport is well enough described within the thermionic emission theory framework (TE), whereas in the low temperature interval (T<200 K) the suitable description of the transport is obtained assuming conduction through deep impurity levels and hopping process between continuously destructed localized electron states in the silicon band gap. It is argued that the addition transport mechanisms are induced by the disordered interfacial control layer (DICL) form by the energetic Ag ion incorporated into silicon crystal lattice situated between the metal and the ordered part of the semiconductor.
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