使用TeraScanHR检测32nm逻辑和50nm以下半间距存储器线的结果

Jean-Paul Sier, William H. Broadbent, F. Mirzaagha, Paul Yu
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引用次数: 3

摘要

最近可用的TeraScanHR划线检查系统的结果于2007年初公布。这些结果显示了45nm逻辑和5xnm半间距存储器先进生产线的出色检测能力,从而满足了2007年年中开始生产的行业需求。从那时起,该系统一直在生产中使用。在2007年初,一些证据显示有能力检查下一个节点的网格,32nm逻辑和低于50nm的半间距存储器,但由于这些网格的可用性有限,结果是不完整的。然而,从那时起,更多的这些先进的线已经可用。图中显示了使用TeraScanHR对来自不同前沿光线制造商的这些先进光线的检测结果。这些结果表明,该系统有能力为持续的开发工作提供所需的检测灵敏度,以支持行业路线图。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Inspection results for 32nm logic and sub-50nm half-pitch memory reticles using the TeraScanHR
Results from the recently available TeraScanHR reticle inspection system were published in early 2007. These results showed excellent inspection capability for 45nm logic and 5xnm half-pitch memory advanced production reticles, thus meeting the industry need for the mid-2007 start of production. The system has been in production use since that time. In early 2007, some evidence was shown of capability to inspect reticles for the next nodes, 32nm logic and sub-50nm half-pitch memory, but the results were incomplete due to the limited availability of such reticles. However, more of these advanced reticles have become available since that time. Inspection results of these advanced reticles from various leading edge reticle manufacturers using the TeraScanHR are shown. These results indicate that the system has the capability to provide the needed inspection sensitivity for continued development work to support the industry roadmap.
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