{"title":"3D-MCM用CVD金刚石膜散热片散热性能分析","authors":"Kuojun Xie, Changshun Jiang, Haifeng Xu, Lin Zhu","doi":"10.1109/ICEPT.2005.1564629","DOIUrl":null,"url":null,"abstract":"3D-MCM may play a important role in microelectronics in next century, a key problem must be solved: how to remove internal heat to exterior effectively in practical use . This work describes the use of CVD-diamond on stacked 3D-MCM thermal management, the symmetry of the model was utilized, a three dimensional model of only 1/4 section of the model was built and numerical simulation based on FEA was performed. A comparison was made between the calculated temperature distribution using CVD-Diamond and that using other materials .","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Analysis of Heat Dissipation Performance of CVD Diamond Film’s Sink for 3D-MCM\",\"authors\":\"Kuojun Xie, Changshun Jiang, Haifeng Xu, Lin Zhu\",\"doi\":\"10.1109/ICEPT.2005.1564629\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"3D-MCM may play a important role in microelectronics in next century, a key problem must be solved: how to remove internal heat to exterior effectively in practical use . This work describes the use of CVD-diamond on stacked 3D-MCM thermal management, the symmetry of the model was utilized, a three dimensional model of only 1/4 section of the model was built and numerical simulation based on FEA was performed. A comparison was made between the calculated temperature distribution using CVD-Diamond and that using other materials .\",\"PeriodicalId\":234537,\"journal\":{\"name\":\"2005 6th International Conference on Electronic Packaging Technology\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-08-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 6th International Conference on Electronic Packaging Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2005.1564629\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 6th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2005.1564629","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analysis of Heat Dissipation Performance of CVD Diamond Film’s Sink for 3D-MCM
3D-MCM may play a important role in microelectronics in next century, a key problem must be solved: how to remove internal heat to exterior effectively in practical use . This work describes the use of CVD-diamond on stacked 3D-MCM thermal management, the symmetry of the model was utilized, a three dimensional model of only 1/4 section of the model was built and numerical simulation based on FEA was performed. A comparison was made between the calculated temperature distribution using CVD-Diamond and that using other materials .
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