UBM用溅射镍薄膜的力学性能研究

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396680

V. N. Sekhar, V. Srinivasarao, R. Jayaganthan, K. Mohankumar, A. Tay

{"title":"UBM用溅射镍薄膜的力学性能研究","authors":"V. N. Sekhar, V. Srinivasarao, R. Jayaganthan, K. Mohankumar, A. Tay","doi":"10.1109/EPTC.2004.1396680","DOIUrl":null,"url":null,"abstract":"Nickel films of different thicknesses of 0.5 and 0.8 /spl mu/m were deposited by DC magnetron sputtering on the adhesion promoting Ta layer deposited on the silicon (100) wafer. The sputtering conditions used were 4 /spl times/ 10/sup -6/ base pressure; 3 /spl times/ 10/sup -1/ working pressure; 4 kW sputter power for 8 inch targets. The films were annealed in vacuum at temperature 200/spl deg/C and their elastic modulus and hardness were measured by nanoindentation technique (hysitron triboscope). Different load rates were used when indenting the samples. The influence of thickness and annealing temperature on the mechanical behaviour of nickel thin films is explored in the present work.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A study on the mechanical behavior of the sputtered nickel thin films for UBM applications\",\"authors\":\"V. N. Sekhar, V. Srinivasarao, R. Jayaganthan, K. Mohankumar, A. Tay\",\"doi\":\"10.1109/EPTC.2004.1396680\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nickel films of different thicknesses of 0.5 and 0.8 /spl mu/m were deposited by DC magnetron sputtering on the adhesion promoting Ta layer deposited on the silicon (100) wafer. The sputtering conditions used were 4 /spl times/ 10/sup -6/ base pressure; 3 /spl times/ 10/sup -1/ working pressure; 4 kW sputter power for 8 inch targets. The films were annealed in vacuum at temperature 200/spl deg/C and their elastic modulus and hardness were measured by nanoindentation technique (hysitron triboscope). Different load rates were used when indenting the samples. The influence of thickness and annealing temperature on the mechanical behaviour of nickel thin films is explored in the present work.\",\"PeriodicalId\":370907,\"journal\":{\"name\":\"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2004.1396680\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2004.1396680","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

采用直流磁控溅射的方法，在硅(100)晶圆上沉积的促附Ta层上沉积了不同厚度0.5和0.8 /spl mu/m的镍膜。溅射条件为4 /spl倍/ 10/sup -6/基压;3 /spl次/ 10/sup -1/工作压力;4千瓦溅射功率为8英寸目标。在200/spl℃的真空条件下对薄膜进行退火处理，利用纳米压痕技术(内磁摩擦仪)测量薄膜的弹性模量和硬度。在缩进样品时使用不同的加载速率。本文探讨了厚度和退火温度对镍薄膜力学性能的影响。

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A study on the mechanical behavior of the sputtered nickel thin films for UBM applications

Nickel films of different thicknesses of 0.5 and 0.8 /spl mu/m were deposited by DC magnetron sputtering on the adhesion promoting Ta layer deposited on the silicon (100) wafer. The sputtering conditions used were 4 /spl times/ 10/sup -6/ base pressure; 3 /spl times/ 10/sup -1/ working pressure; 4 kW sputter power for 8 inch targets. The films were annealed in vacuum at temperature 200/spl deg/C and their elastic modulus and hardness were measured by nanoindentation technique (hysitron triboscope). Different load rates were used when indenting the samples. The influence of thickness and annealing temperature on the mechanical behaviour of nickel thin films is explored in the present work.

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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