芯片上仪器的安全性和可访问性的协同优化

E. Larsson
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引用次数: 0

摘要

半导体技术的不断发展使集成电路(ic)具有更多、更快和更小的晶体管。虽然有许多优势,但也有许多新的挑战,例如利润更低、磨损和工艺变化。为了应对这些挑战,在人工制造测试中使用外部测试仪器的传统方法必须与芯片上的仪器相辅相成,以提供测试在运行寿命期间出现的缺陷的可能性。这些片上仪器一方面提供了更好的可控性和可观察性,这有助于测试目的。另一方面,控制和观察IC内部的可能性增加可能是一种安全风险。我们讨论了如何为这些片上仪器提供访问以及如何共同优化安全性和可访问性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Co-optimization of security and accessibility to on-chip instruments
The semiconductor technology development constantly enables integrated circuits (ICs) with more, faster and smaller transistors. While there are many advantages, there are also many and new challenges, for example tighter margins, wear-outs and process variations. To address these challenges, the traditional approach with external test instruments used at man-ufacturing test must be complemented with on-chip instruments to provide possibilities to test for defects that manifest themselves during the operational lifetime. These on-chip instruments provide, on one hand, better controllability and observability, which is helpful for testing purposes. On the other hand, the increased possibility to control and observable the IC's internals can be a security risk. We discuss how to provide access and how to co-optimize security and accessibility for these on-chip instruments.
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