{"title":"基于三维非线性热电耦合模型的SWEAT结构有限元分析","authors":"M. Dion","doi":"10.1109/RELPHY.1992.187651","DOIUrl":null,"url":null,"abstract":"The complexities of determining thermal characteristics within the standard wafer electromigration accelerated test (SWEAT) structure during accelerated metal integrity or electromigration tests are discussed. A 3-D, nonlinear, coupled thermal-electric finite element model is developed and was solved with the ANSYS program to investigate heat flow in several regions of the structure. The finite element model is presented. Correlation with nonlinear thermal material parameters is demonstrated, and the importance of modeling lateral heat flow in underlying oxides is shown. Extraction of thermal parameters for use in the EXTRA thermal model is discussed.<<ETX>>","PeriodicalId":154383,"journal":{"name":"30th Annual Proceedings Reliability Physics 1992","volume":"234 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Finite element analysis of a SWEAT structure with a 3-D, nonlinear, coupled thermal-electric model\",\"authors\":\"M. Dion\",\"doi\":\"10.1109/RELPHY.1992.187651\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The complexities of determining thermal characteristics within the standard wafer electromigration accelerated test (SWEAT) structure during accelerated metal integrity or electromigration tests are discussed. A 3-D, nonlinear, coupled thermal-electric finite element model is developed and was solved with the ANSYS program to investigate heat flow in several regions of the structure. The finite element model is presented. Correlation with nonlinear thermal material parameters is demonstrated, and the importance of modeling lateral heat flow in underlying oxides is shown. Extraction of thermal parameters for use in the EXTRA thermal model is discussed.<<ETX>>\",\"PeriodicalId\":154383,\"journal\":{\"name\":\"30th Annual Proceedings Reliability Physics 1992\",\"volume\":\"234 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"30th Annual Proceedings Reliability Physics 1992\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1992.187651\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"30th Annual Proceedings Reliability Physics 1992","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1992.187651","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Finite element analysis of a SWEAT structure with a 3-D, nonlinear, coupled thermal-electric model
The complexities of determining thermal characteristics within the standard wafer electromigration accelerated test (SWEAT) structure during accelerated metal integrity or electromigration tests are discussed. A 3-D, nonlinear, coupled thermal-electric finite element model is developed and was solved with the ANSYS program to investigate heat flow in several regions of the structure. The finite element model is presented. Correlation with nonlinear thermal material parameters is demonstrated, and the importance of modeling lateral heat flow in underlying oxides is shown. Extraction of thermal parameters for use in the EXTRA thermal model is discussed.<>
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