{"title":"后包装修边金属熔断器失效分析与优化","authors":"Yu-Hsing Cheng, C. Kendrick","doi":"10.1109/RELPHY.2007.369978","DOIUrl":null,"url":null,"abstract":"Post package trimming is important in achieving precise control of circuit parameters that may shift due to package stresses. However, the size of on-chip driver circuitry must be minimized while still maintaining reliably trimmed fuses. This study presents a statistical analysis and physical characterization of trimmed fuses to optimize fuse geometry and trimming conditions.","PeriodicalId":433104,"journal":{"name":"2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual","volume":"187 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Failure Analysis and Optimization of Metal Fuses for Post Package Trimming\",\"authors\":\"Yu-Hsing Cheng, C. Kendrick\",\"doi\":\"10.1109/RELPHY.2007.369978\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Post package trimming is important in achieving precise control of circuit parameters that may shift due to package stresses. However, the size of on-chip driver circuitry must be minimized while still maintaining reliably trimmed fuses. This study presents a statistical analysis and physical characterization of trimmed fuses to optimize fuse geometry and trimming conditions.\",\"PeriodicalId\":433104,\"journal\":{\"name\":\"2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual\",\"volume\":\"187 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.2007.369978\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.2007.369978","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Failure Analysis and Optimization of Metal Fuses for Post Package Trimming
Post package trimming is important in achieving precise control of circuit parameters that may shift due to package stresses. However, the size of on-chip driver circuitry must be minimized while still maintaining reliably trimmed fuses. This study presents a statistical analysis and physical characterization of trimmed fuses to optimize fuse geometry and trimming conditions.
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