用于评价硅衬底的测试结构

Y. Kokawa, M. Kimura, M. Kume, H. Yamamoto, A. Koyama
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引用次数: 0

摘要

采用平板电容、场边缘阵列和栅极边缘阵列等多种测试结构,研究了硅衬底质量对氧化物可靠性的影响。实验结果表明,与实际装置条件相似的场边阵列测试结构可以有效地测定氧化物的质量。在P/sup +/硅衬底的P型外延层上生长的氧化物在所有测试结构中表现出最高的可靠性。P/sup +/硅衬底对重金属和/或晶体缺陷的吸附是提高氧化物可靠性的主要机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Test structures for the evaluation of Si substrates
The quality of Si substrates affecting the oxide reliability was investigated using various kinds of test structures like flat capacitor, field edge array and gate edge array. The field edge array test structure which resembles the conditions found for a real device is shown to be quite effective to determine the quality of oxides. Oxide grown on a P type epitaxial layer on P/sup +/ silicon substrate shows highest reliability in all test structures. Gettering of heavy metals and/or crystal defects by the P/sup +/ silicon substrate is the dominant mechanism for the improvement of the oxide reliability.
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