{"title":"利用纳米效应增强热性能","authors":"B. Wunderle","doi":"10.1109/ESIME.2010.5464506","DOIUrl":null,"url":null,"abstract":"Thermal interface material resistance is one of the bottlenecks for efficient thermal management. Much research has been undertaken in the last years to overcome the finite thermal conductivity as well as the interface resistance of, above all, polymer-based TIMs varying material parameters such as filler particles material, size and modality as well as matrix material properties.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Thermal performance enhancement by exploitation of nano-effects\",\"authors\":\"B. Wunderle\",\"doi\":\"10.1109/ESIME.2010.5464506\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thermal interface material resistance is one of the bottlenecks for efficient thermal management. Much research has been undertaken in the last years to overcome the finite thermal conductivity as well as the interface resistance of, above all, polymer-based TIMs varying material parameters such as filler particles material, size and modality as well as matrix material properties.\",\"PeriodicalId\":152004,\"journal\":{\"name\":\"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"56 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-04-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2010.5464506\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2010.5464506","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal performance enhancement by exploitation of nano-effects
Thermal interface material resistance is one of the bottlenecks for efficient thermal management. Much research has been undertaken in the last years to overcome the finite thermal conductivity as well as the interface resistance of, above all, polymer-based TIMs varying material parameters such as filler particles material, size and modality as well as matrix material properties.