{"title":"后钻过孔的电磁模型","authors":"A. Rong, A. Cangellaris, Feng Ling","doi":"10.1109/EPEPS.2015.7347127","DOIUrl":null,"url":null,"abstract":"The Foldy-Lax formulation for the electromagnetic modeling of planar, multilayered substrates with multiple pins and vias is extended to include the presence of back-drilled via holes. A validation study of the accuracy of the proposed model is also presented.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"111 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An electromagnetic model for back-drilled vias\",\"authors\":\"A. Rong, A. Cangellaris, Feng Ling\",\"doi\":\"10.1109/EPEPS.2015.7347127\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Foldy-Lax formulation for the electromagnetic modeling of planar, multilayered substrates with multiple pins and vias is extended to include the presence of back-drilled via holes. A validation study of the accuracy of the proposed model is also presented.\",\"PeriodicalId\":130864,\"journal\":{\"name\":\"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"volume\":\"111 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2015.7347127\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2015.7347127","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The Foldy-Lax formulation for the electromagnetic modeling of planar, multilayered substrates with multiple pins and vias is extended to include the presence of back-drilled via holes. A validation study of the accuracy of the proposed model is also presented.