圣何塞州立大学微电子封装课程开发

G. Selvaduray, F. Baret
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引用次数: 5

摘要

本文描述了圣何塞州立大学工程学院在本科和研究生阶段的微电子封装工程教育课程的发展。讨论了开设课程的动机,以支持这样的课程和本地电子工业的需要。本科课程采用讲座/实验的教学模式,要求学生进行实验。跨学科的研究生课程是作为工程硕士课程的一个专业领域提供的。邀请来自业界的演讲嘉宾讨论这个不断发展的领域的进步和挑战。学院还为在工业中实习的工程师提供短期课程。在国家科学基金的资助下,提高大学教师技能的讲习班目前正处于规划阶段;1997-1998年期间将举办四次这样的讲习班。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Microelectronics packaging curriculum development at San Jose State University
This paper describes the development of an engineering education curriculum in microelectronic packaging at both the undergraduate and graduate levels, at the College of Engineering, San Jose State University. Motivation for establishing courses to support such a curriculum and the needs of the local electronics industry are discussed. The undergraduate courses are taught in the lecture/laboratory mode, thus requiring students to conduct experiments. The interdisciplinary graduate curriculum is offered as an area of specialization within the Master of Science in Engineering program. Guest speakers from industry are invited to discuss advances and challenges present in this constantly evolving field. The College also offers short courses for engineers practicing in industry. With NSF funding, workshops for skills enhancement of university faculty are currently in the planning stage; four such workshops will be offered during 1997-1998.
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