Wire and via modeling and simulation solutions for a tri-grid mesh plane ceramic packaging

To accurately evaluate interconnect net electrical properties of the tri-grid structure we need to model the wires and vias in this structure. Due to the high application frequencies and the non-TEM nature of the propagating mode in this structure, the use of full-wave electromagnetic tools is necessary. In this paper we describe the principles and results of three different modeling and simulation solutions. The modeling and simulation solutions are based on full-wave electromagnetic simulations on short physical structure sections. The solutions can be applied to the transient circuit simulation on longer interconnect nets for evaluating system reflection, transmission, near end noise, and far end noise. The comparison shows the per-unit-length RLGC is the most efficient model and simulation method for this application