{"title":"3D-CSP:一种基于RMPD的创新包装方法","authors":"Helge Bohlmann, Reiner Goetzen, A. Reinhardt","doi":"10.1117/12.425300","DOIUrl":null,"url":null,"abstract":"A major bottleneck in the applications of microtechnologies are packaging and interconnection techniques. 3D-CSP (3D-Chip-Size- Packaging), which is based on RMPDTM, solves an extremely wide range of packaging problems. RMPDTM and 3D-CSP are discussed and applications presented.","PeriodicalId":429610,"journal":{"name":"Microelectronic and MEMS Technologies","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"3D-CSP: an innovative packaging method based on RMPD\",\"authors\":\"Helge Bohlmann, Reiner Goetzen, A. Reinhardt\",\"doi\":\"10.1117/12.425300\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A major bottleneck in the applications of microtechnologies are packaging and interconnection techniques. 3D-CSP (3D-Chip-Size- Packaging), which is based on RMPDTM, solves an extremely wide range of packaging problems. RMPDTM and 3D-CSP are discussed and applications presented.\",\"PeriodicalId\":429610,\"journal\":{\"name\":\"Microelectronic and MEMS Technologies\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-04-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronic and MEMS Technologies\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.425300\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronic and MEMS Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.425300","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
3D-CSP: an innovative packaging method based on RMPD
A major bottleneck in the applications of microtechnologies are packaging and interconnection techniques. 3D-CSP (3D-Chip-Size- Packaging), which is based on RMPDTM, solves an extremely wide range of packaging problems. RMPDTM and 3D-CSP are discussed and applications presented.
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