电路与压电层压板的耦合仿真

Fourth International Symposium on Quality Electronic Design, 2003. Proceedings. Pub Date : 2003-03-24 DOI:10.1109/ISQED.2003.1194760

Chenggang Xu, T. Fiez, K. Mayaram

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引用次数: 1

摘要

本文提出了一种电路与压电层压器件耦合仿真的算法。在SPICE框架中包含了压电层合板的有限元求解器作为电容器。该电容器的电荷是终端电压和压电材料中机械应变的函数。该耦合模拟器可以实现基于压电层压板的新型微型发电电路的仿真。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Coupled simulation of circuit and piezoelectric laminates

In this paper, an algorithm for the coupled simulation of circuit and piezoelectric laminate devices is presented. A finite element solver for piezoelectric laminates is included in the SPICE framework as a capacitor. The charge of this capacitor is a function of both the terminal voltage and the mechanical strain in the piezoelectric material. The coupled simulator allows simulation of novel micro power generation circuits based on piezoelectric laminates.

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Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.

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