在高级技术节点上进行软错误建模、仿真和测试

B. Bhuva, W. T. Holman, L. Massengill
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引用次数: 2

摘要

随着特征尺寸的减小,软误差有望成为集成电路的主要失效机制。本文讨论了设计和可靠性工程师在先进技术节点上集成电路的制造和测试所面临的挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Soft error modeling, simulation, and testing at advanced technology nodes
As feature sizes decrease, soft errors are expected to become the dominant failure mechanisms for integrated circuits. This paper discusses the challenges that design and reliability engineers will face with the manufacture and test of ICs at advanced technology nodes.
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