{"title":"在高级技术节点上进行软错误建模、仿真和测试","authors":"B. Bhuva, W. T. Holman, L. Massengill","doi":"10.1109/ICICDT.2011.5783237","DOIUrl":null,"url":null,"abstract":"As feature sizes decrease, soft errors are expected to become the dominant failure mechanisms for integrated circuits. This paper discusses the challenges that design and reliability engineers will face with the manufacture and test of ICs at advanced technology nodes.","PeriodicalId":402000,"journal":{"name":"2011 IEEE International Conference on IC Design & Technology","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Soft error modeling, simulation, and testing at advanced technology nodes\",\"authors\":\"B. Bhuva, W. T. Holman, L. Massengill\",\"doi\":\"10.1109/ICICDT.2011.5783237\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As feature sizes decrease, soft errors are expected to become the dominant failure mechanisms for integrated circuits. This paper discusses the challenges that design and reliability engineers will face with the manufacture and test of ICs at advanced technology nodes.\",\"PeriodicalId\":402000,\"journal\":{\"name\":\"2011 IEEE International Conference on IC Design & Technology\",\"volume\":\"59 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-05-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE International Conference on IC Design & Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICICDT.2011.5783237\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE International Conference on IC Design & Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICDT.2011.5783237","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Soft error modeling, simulation, and testing at advanced technology nodes
As feature sizes decrease, soft errors are expected to become the dominant failure mechanisms for integrated circuits. This paper discusses the challenges that design and reliability engineers will face with the manufacture and test of ICs at advanced technology nodes.