Wootae Lee, Jubong Park, Jungho Shin, J. Woo, Seonghyun Kim, G. Choi, Seungjae Jung, Sangsu Park, Daeseok Lee, E. Cha, H. Lee, S. Kim, Suock Chung, H. Hwang
{"title":"用于3D双极电阻式存储阵列的压敏型双向开关(JMAX>107A/cm2,选择性~ 104)","authors":"Wootae Lee, Jubong Park, Jungho Shin, J. Woo, Seonghyun Kim, G. Choi, Seungjae Jung, Sangsu Park, Daeseok Lee, E. Cha, H. Lee, S. Kim, Suock Chung, H. Hwang","doi":"10.1109/VLSIT.2012.6242449","DOIUrl":null,"url":null,"abstract":"We demonstrate a varistor-type bidirectional switch (VBS) with excellent selection property for future 3D bipolar resistive memory array. A highly non-linear VBS showed superior performances including high current density (>;3×10<sup>7</sup>A/cm<sup>2</sup>) and high selectivity (~10<sup>4</sup>). The non-linear I-V characteristics can be explained by varistor-type multi-layer tunnel barriers, which were formed by Ta incorporation into thin TiO<sub>2</sub>. Furthermore, the 1S1R device showed excellent suppression of leakage current (>;10<sup>4</sup> reduction) at 1/2V<sub>READ</sub>, which is promising for ultra-high density resistive memory applications.","PeriodicalId":266298,"journal":{"name":"2012 Symposium on VLSI Technology (VLSIT)","volume":"147 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"65","resultStr":"{\"title\":\"Varistor-type bidirectional switch (JMAX>107A/cm2, selectivity∼104) for 3D bipolar resistive memory arrays\",\"authors\":\"Wootae Lee, Jubong Park, Jungho Shin, J. Woo, Seonghyun Kim, G. Choi, Seungjae Jung, Sangsu Park, Daeseok Lee, E. Cha, H. Lee, S. Kim, Suock Chung, H. Hwang\",\"doi\":\"10.1109/VLSIT.2012.6242449\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We demonstrate a varistor-type bidirectional switch (VBS) with excellent selection property for future 3D bipolar resistive memory array. A highly non-linear VBS showed superior performances including high current density (>;3×10<sup>7</sup>A/cm<sup>2</sup>) and high selectivity (~10<sup>4</sup>). The non-linear I-V characteristics can be explained by varistor-type multi-layer tunnel barriers, which were formed by Ta incorporation into thin TiO<sub>2</sub>. Furthermore, the 1S1R device showed excellent suppression of leakage current (>;10<sup>4</sup> reduction) at 1/2V<sub>READ</sub>, which is promising for ultra-high density resistive memory applications.\",\"PeriodicalId\":266298,\"journal\":{\"name\":\"2012 Symposium on VLSI Technology (VLSIT)\",\"volume\":\"147 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-06-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"65\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 Symposium on VLSI Technology (VLSIT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSIT.2012.6242449\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 Symposium on VLSI Technology (VLSIT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2012.6242449","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Varistor-type bidirectional switch (JMAX>107A/cm2, selectivity∼104) for 3D bipolar resistive memory arrays
We demonstrate a varistor-type bidirectional switch (VBS) with excellent selection property for future 3D bipolar resistive memory array. A highly non-linear VBS showed superior performances including high current density (>;3×107A/cm2) and high selectivity (~104). The non-linear I-V characteristics can be explained by varistor-type multi-layer tunnel barriers, which were formed by Ta incorporation into thin TiO2. Furthermore, the 1S1R device showed excellent suppression of leakage current (>;104 reduction) at 1/2VREAD, which is promising for ultra-high density resistive memory applications.