3D封装失效分析挑战及解决方案

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI:10.1109/EPTC.2015.7412374

F. Chao, Li Xiaomin, J. Kow

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引用次数: 2

摘要

复杂的多模、多部件结构的三维封装在电气测试、封装故障隔离和物理失效分析方面提出了新的失效分析挑战。本文着重介绍了利用三维x射线和其他技术的新方法。

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3D package failure analysis challenge and solution

3D packaging with complex multi die and multi component structure has new Failure Analysis challenges in electrical testing, package fault isolation and physical failure analysis. This paper emphasize on new approach using 3D X-Ray other techniques.

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来源期刊

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

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