{"title":"试验与有限元相结合的SM- cob技术热力可靠性评估","authors":"R. Dudek, B. Michel","doi":"10.1109/RELPHY.1994.307799","DOIUrl":null,"url":null,"abstract":"In the paper, the authors address the issue of thermo-mechanically stressed microelectronic assemblies. An approach combining finite element simulation and advanced in-situ measuring techniques are presented. Examples given in the text illustrate the application of the experimental methods such as micro moire technique, speckle pattern photography or X-ray stress analysis in connection with numerical simulations. Finally, actual results concerning solder joint reliability are discussed.<<ETX>>","PeriodicalId":276224,"journal":{"name":"Proceedings of 1994 IEEE International Reliability Physics Symposium","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Thermomechanical reliability assessment in SM- and COB-technology by combined experimental and finite element method\",\"authors\":\"R. Dudek, B. Michel\",\"doi\":\"10.1109/RELPHY.1994.307799\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the paper, the authors address the issue of thermo-mechanically stressed microelectronic assemblies. An approach combining finite element simulation and advanced in-situ measuring techniques are presented. Examples given in the text illustrate the application of the experimental methods such as micro moire technique, speckle pattern photography or X-ray stress analysis in connection with numerical simulations. Finally, actual results concerning solder joint reliability are discussed.<<ETX>>\",\"PeriodicalId\":276224,\"journal\":{\"name\":\"Proceedings of 1994 IEEE International Reliability Physics Symposium\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1994 IEEE International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1994.307799\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1994.307799","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermomechanical reliability assessment in SM- and COB-technology by combined experimental and finite element method
In the paper, the authors address the issue of thermo-mechanically stressed microelectronic assemblies. An approach combining finite element simulation and advanced in-situ measuring techniques are presented. Examples given in the text illustrate the application of the experimental methods such as micro moire technique, speckle pattern photography or X-ray stress analysis in connection with numerical simulations. Finally, actual results concerning solder joint reliability are discussed.<>
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