Francis Nikolai Lupena, Siew Mei Teo, Rowin V. Galarce
{"title":"CMOS低差稳压器件的模具裂纹失效研究","authors":"Francis Nikolai Lupena, Siew Mei Teo, Rowin V. Galarce","doi":"10.1109/IPFA.2016.7564273","DOIUrl":null,"url":null,"abstract":"There are recent failures on a Low Dropout (LDO) Regulator where the customer is experiencing an out of specification output voltage. This paper aims to investigate the exact root cause of the failure by detailed failure analysis and relating the customer complaint to the die crack observed.","PeriodicalId":206237,"journal":{"name":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"41 7","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Failure investigation of a die crack on a CMOS low dropout regulator device\",\"authors\":\"Francis Nikolai Lupena, Siew Mei Teo, Rowin V. Galarce\",\"doi\":\"10.1109/IPFA.2016.7564273\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"There are recent failures on a Low Dropout (LDO) Regulator where the customer is experiencing an out of specification output voltage. This paper aims to investigate the exact root cause of the failure by detailed failure analysis and relating the customer complaint to the die crack observed.\",\"PeriodicalId\":206237,\"journal\":{\"name\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"41 7\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2016.7564273\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2016.7564273","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Failure investigation of a die crack on a CMOS low dropout regulator device
There are recent failures on a Low Dropout (LDO) Regulator where the customer is experiencing an out of specification output voltage. This paper aims to investigate the exact root cause of the failure by detailed failure analysis and relating the customer complaint to the die crack observed.