{"title":"采用创新的多链路测试结构，改进了铜电迁移中低故障率的统计分析","authors":"F. Bana, D. Ney, L. Arnaud, Y. Wouters","doi":"10.1109/IITC.2012.6251668","DOIUrl":null,"url":null,"abstract":"An innovative electromigration test structure is described in this paper. This new structure consisting of serial connected links is designed to address very early percentiles of lognormal electromigration failure time distribution and highlight extrinsic failures. The simplicity of implementation, data treatment and the correlation with elemental dual damascene test lines make this structure a pretty good candidate for the future of interconnects reliability.","PeriodicalId":165741,"journal":{"name":"2012 IEEE International Interconnect Technology Conference","volume":"12 S1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-06-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Improved statistical analysis at low failure rates in Cu electromigration using an innovative multilink test structure\",\"authors\":\"F. Bana, D. Ney, L. Arnaud, Y. Wouters\",\"doi\":\"10.1109/IITC.2012.6251668\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An innovative electromigration test structure is described in this paper. This new structure consisting of serial connected links is designed to address very early percentiles of lognormal electromigration failure time distribution and highlight extrinsic failures. The simplicity of implementation, data treatment and the correlation with elemental dual damascene test lines make this structure a pretty good candidate for the future of interconnects reliability.\",\"PeriodicalId\":165741,\"journal\":{\"name\":\"2012 IEEE International Interconnect Technology Conference\",\"volume\":\"12 S1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-06-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE International Interconnect Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2012.6251668\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE International Interconnect Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2012.6251668","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Improved statistical analysis at low failure rates in Cu electromigration using an innovative multilink test structure
An innovative electromigration test structure is described in this paper. This new structure consisting of serial connected links is designed to address very early percentiles of lognormal electromigration failure time distribution and highlight extrinsic failures. The simplicity of implementation, data treatment and the correlation with elemental dual damascene test lines make this structure a pretty good candidate for the future of interconnects reliability.
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