单片平面射频电感和波导结构,性能可与GaAs MMIC相媲美

Bonkee Kim, B. Ko, K. Lee, Ji-Won Jeong, Kun-Sang Lee, Seong-Chan Kim
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引用次数: 87

摘要

采用极厚聚酰亚胺(10 /spl μ m)作为介质材料,采用厚铝(4 /spl μ m)金属化体系,在硅衬底上实现了高Q因数、低插入损耗、高谐振频率的单片电感和传输线。这种结构是在成品的常规标准双层金属化BiCMOS晶圆上制造的。对于10 nH电感,可获得6 GHz的谐振频率,1.2 GHz时最大Q因子为5.5,3 GHz时的插入损耗为1.2 dB,与现有的GaAs MMIC相当,这些电感既可以用作射频扼流圈,也可以用作匹配元件。传输线也使用这种技术制造。长度为1mm的共面波导在4ghz时的S/sub /为-0.2 dB,微带线的S/sub /为-0.3 dB。预计使用这些无源元件,Si RF IC可以设计出高达几GHz的性能可与GaAs MMIC媲美。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Monolithic planar RF inductor and waveguide structures on silicon with performance comparable to those in GaAs MMIC
The monolithic inductors and transmission lines on Si substrate with very high Q factor, low insertion loss, and high resonant frequency, are achieved by using very thick polyimide (10 /spl mu/m) as dielectric material, and thick Al (4 /spl mu/m) metalization system. This structure is made on the finished conventional standard two layer metalization BiCMOS wafer. For 10 nH inductor, 6 GHz resonant frequency, maximum Q factor of 5.5 at 1.2 GHz, and 1.2 dB insertion loss at 3 GHz are obtained, which are very comparable to those available in GaAs MMIC, These inductors can be used as RF choke as well as matching element. Transmission lines are also fabricated using this technology. The S/sub 21/ of coplanar waveguide with 1 mm length is -0.2 dB at 4 GHz, and that of microstrip line is -0.3 dB. It is expected that, using these passive elements, Si RF IC can be designed up to several GHz with performance comparable to GaAs MMIC.
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