Drop test for Sn96.7-Ag3.7 polymer core solder ball in BGA package

Abstract

Using polymer core solder ball in ball-grid-array (BGA) package instead of solid solder ball in cost consideration is a feasible choice. Besides the consideration for inter-metallic compound (IMC) between solder ball and carrier substrate, the reliability test for drop test is necessary. Following the commercial specification test conditions, this candidate demonstrates an impressive performance. The uniformity for the test results is also better than that with the control group. The slope value and scale parameter of Weibull distribution adopted in this statistic calculation illustrated the polymer core solder ball in BGA package owned the wonderful bombardment endurance capability, incorporated with the ENEPIG processing recipe for substrate metal finish.