Hybrid modeling and analysis of different through-silicon-Via (TSV)-based 3D power distribution networks

Zheng Xu, J. J. Lu
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引用次数: 3

Abstract

This paper reports on a novel partition and assembly approach that combines both the electromagnetic (EM) and analytical simulations to accurately model and analyze several through-silicon-via (TSV) based 3D power delivery networks, which are composed of various stacked-chips, interposer, and package substrate. With this method, we also analyzed RLC couplings between multiple voltage supply rails in 3D systems. The quantitatively examined power performance unveils 3D power delivery design implications, which is useful for 3D system design and fabrication.
基于硅通孔(TSV)的三维配电网络的混合建模与分析
本文报道了一种新的划分和组装方法,该方法结合了电磁(EM)和分析模拟来精确建模和分析几种基于硅通孔(TSV)的3D电力输送网络,这些网络由各种堆叠芯片,中间层和封装衬底组成。利用该方法,我们还分析了三维系统中多个电压供电轨之间的RLC耦合。定量检测的功率性能揭示了3D功率传输设计的含义,这对3D系统的设计和制造是有用的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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