Advance Process Control solutions for semiconductor manufacturing

M. Sarfaty, A. Shanmugasundram, A. Schwarm, J. Paik, Jimin Zhang, R. Pan, M. Seamons, H. Li, R. Hung, S. Parikh
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引用次数: 21

Abstract

Traditional semiconductor manufacturing relies on a fixed process-recipe combined with a classical statistical process control that is used to monitor the production process. Leading-edge manufacturing processes require higher levels of precision and accuracy, which necessitate the use of tighter process control. Advanced Process Control (APC) is becoming a critical component to improve performance, yield, throughput, and flexibility of the manufacturing process using run-to-run, wafer-to-wafer, within wafer and real-time process control. The complexity of device manufacturing process as well as the strong coupling effect of several input parameters on the final process outputs prohibit the use of a classical single variable feedback control method. Therefore, multivariate, model-based APC system is developed in conjunction with feed-forward and feedback mechanisms to automatically determine the optimal recipe for each wafer based on both incoming wafer and tool state properties. The APC system uses wafer metrology, process models and sophisticated control algorithms to provide dynamic fine-tuning of intermediate process targets that enhance final device targets. The design of the APC system enables scalable control solutions across a single chamber, a process tool, multi-tools, a process module and multi-process modules using similar building blocks, concepts and algorithms.
先进的半导体制造过程控制解决方案
传统的半导体制造依赖于固定的工艺配方与经典的统计过程控制相结合,用于监控生产过程。领先的制造工艺需要更高的精度和准确性,这就需要使用更严格的过程控制。先进过程控制(APC)正在成为通过运行到运行、晶圆到晶圆、晶圆内和实时过程控制来提高制造过程的性能、良率、吞吐量和灵活性的关键组成部分。器件制造过程的复杂性以及多个输入参数对最终过程输出的强耦合效应使得经典的单变量反馈控制方法无法使用。因此,基于模型的多变量APC系统与前馈和反馈机制相结合,根据进料晶圆和刀具状态属性自动确定每片晶圆的最佳配方。APC系统使用晶圆计量、过程模型和复杂的控制算法来提供中间过程目标的动态微调,从而增强最终设备目标。APC系统的设计支持跨单腔室、工艺工具、多工具、工艺模块和多工艺模块的可扩展控制解决方案,使用类似的构建块、概念和算法。
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