Multiple electron beam generation from InGaN photocathode

IF 1.4 4区 工程技术
Daiki Sato, H. Shikano, A. Koizumi, T. Nishitani, Y. Honda, H. Amano
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引用次数: 5

Abstract

A p-type InGaN grown on a double-side polished sapphire substrate was used for the photocathode. The surface of p-InGaN was cleaned by heating in the vacuum chamber with a base pressure of 5×10-9 Pa. Cs and O2 were alternately supplied on the surface for activation of the photocathode(3). The quantum efficiency immediately after the activation process was 14%. The electron gun test system was composed of a cathode electrode, an anode electrode, an electrostatic lens, and a fluorescent screen. The voltages applied to the cathode electrode and the electrostatic lens were -15 and -8.6 kV, respectively. A Gaussian-distributed laser with a wavelength of 405 nm was diffracted by liquid crystal on silicon, divided into 25 laser beams, and irradiated on the InGaN photocathode from its backside. Each laser beam had Gaussian distribution with a diameter of 30 μm and an interval of 310 μm (Figure 1(a)). The generated multiple electron-beam was observed by the fluorescent screen. Deviations in the diameter of each electron beam was evaluated.
InGaN光电阴极产生多重电子束
在双面抛光蓝宝石衬底上生长的p型InGaN用作光电阴极。在真空室中以5×10-9 Pa的压力加热p-InGaN表面。Cs和O2交替提供在表面以激活光电阴极(3)。激活后的量子效率为14%。电子枪测试系统由阴极电极、阳极电极、静电透镜和荧光屏组成。阴极电极和静电透镜的电压分别为-15 kV和-8.6 kV。采用硅基液晶衍射波长为405nm的高斯分布激光,将其分成25束,从InGaN光电阴极背面照射在其上。每束激光束为高斯分布,直径为30 μm,间隔为310 μm(图1(a))。用荧光屏观察产生的多重电子束。评估了每个电子束直径的偏差。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Vacuum Science & Technology B
Journal of Vacuum Science & Technology B 工程技术-工程:电子与电气
自引率
14.30%
发文量
0
审稿时长
2.5 months
期刊介绍: Journal of Vacuum Science & Technology B emphasizes processing, measurement and phenomena associated with micrometer and nanometer structures and devices. Processing may include vacuum processing, plasma processing and microlithography among others, while measurement refers to a wide range of materials and device characterization methods for understanding the physics and chemistry of submicron and nanometer structures and devices.
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