Effects of Bi and Ni addition on wettability and melting point of Sn-0.3Ag-0.7Cu Low-Ag Pb-free solder

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4607065

Y. Liu, F. Sun, T.L. Yan, W.G. Hu

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引用次数: 6

Abstract

Bi and Ni were added to Sn-0.3Ag-0.7Cu low-Ag solder, to fabricate new low-Ag solders, Sn-0.3Ag-0.7Cu-XBi (X= 1.0, 3.0, 4.5) and Sn-0.3Ag-0.7Cu-XNi (X=0.05, 0.10, 0.15). Melting point tests were carried out with DSC (differential scanning calorimetry) instrument. Wettability tests were conducted on a wetting balance instrument. Test results of the two new solders were compared with that of Sn-0.3Ag-0.7Cu respectively to study the effects of the adding elements on the melting point and wettability of the low-Ag Pb-free solder. It shows that Bi addition has striking positive effects on decreasing the melting point and improving wettability. Ni addition could improve the wettability as well, although not as much as Bi does. And Ni has a negative effect on melting point. With proper adding amount as X=3.0, Bi could significantly improve the wettability and decrease melting point at the same time. However, too much Bi addition could increase the melting range between liquidus and solidus, which may lead to the initiation of solidification crack of the solder joints.

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Bi和Ni添加量对Sn-0.3Ag-0.7Cu低银无铅焊料润湿性和熔点的影响

将Bi和Ni添加到Sn-0.3Ag-0.7Cu低银焊料中，制备出Sn-0.3Ag-0.7Cu- xbi (X= 1.0, 3.0, 4.5)和Sn-0.3Ag-0.7Cu- xni (X=0.05, 0.10, 0.15)两种新型低银焊料。用DSC(差示扫描量热仪)测定熔点。在润湿平衡仪上进行了润湿性试验。将两种新型钎料的测试结果分别与Sn-0.3Ag-0.7Cu钎料的测试结果进行对比，研究添加元素对低银无铅钎料熔点和润湿性的影响。结果表明，添加铋对降低熔点和改善润湿性有显著的积极作用。添加Ni也可以改善润湿性，尽管没有Bi的效果好。Ni对熔点有负影响。适当添加量为X=3.0时，Bi能显著提高润湿性，同时降低熔点。添加过多的铋会增大焊点液固之间的熔化范围，导致焊点产生凝固裂纹。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2008 International Conference on Electronic Packaging Technology & High Density Packaging

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