Statistical Approach for Cycle Time Estimation in Semiconductor Packaging Factories

W. Pearn, Y. Tai, J. Lee
{"title":"Statistical Approach for Cycle Time Estimation in Semiconductor Packaging Factories","authors":"W. Pearn, Y. Tai, J. Lee","doi":"10.1109/TEPM.2009.2022270","DOIUrl":null,"url":null,"abstract":"In the semiconductor industry, to enhance customer satisfactions and ability of quick responses, the development of cycle time estimation model is very important. Cycle time estimation is an essential planning basis, which has many applications, especially on the analyses of performance indexes, capacity planning, and the assignments of due dates. In this paper, we provide a statistical approach for cycle time estimation in semiconductor plastic ball grid array (PBGA) packaging factories. Due to today's fierce competitive environments in the semiconductor industry, planners involved in PBGA packaging factories need an approach to obtain estimated cycle times with different confidence to ensure the due date assignments more accurately. Therefore, upper confidence bounds of estimated cycle times at various confidence coefficients are also presented in this paper. We demonstrate the applicability of the proposed cycle time estimation model incorporating the upper confidence bounds by presenting a real-world example taken from a PBGA packaging shop floor in a semiconductor packaging factory located in the Science-Based Industrial Park in Hsinchu, Taiwan.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"9 1","pages":"198-205"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electronics Packaging Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEPM.2009.2022270","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

Abstract

In the semiconductor industry, to enhance customer satisfactions and ability of quick responses, the development of cycle time estimation model is very important. Cycle time estimation is an essential planning basis, which has many applications, especially on the analyses of performance indexes, capacity planning, and the assignments of due dates. In this paper, we provide a statistical approach for cycle time estimation in semiconductor plastic ball grid array (PBGA) packaging factories. Due to today's fierce competitive environments in the semiconductor industry, planners involved in PBGA packaging factories need an approach to obtain estimated cycle times with different confidence to ensure the due date assignments more accurately. Therefore, upper confidence bounds of estimated cycle times at various confidence coefficients are also presented in this paper. We demonstrate the applicability of the proposed cycle time estimation model incorporating the upper confidence bounds by presenting a real-world example taken from a PBGA packaging shop floor in a semiconductor packaging factory located in the Science-Based Industrial Park in Hsinchu, Taiwan.
半导体封装工厂周期时间估计的统计方法
在半导体行业中,为了提高客户满意度和快速响应能力,开发周期时间估计模型是非常重要的。周期时间估计是一个重要的规划基础,它有许多应用,特别是在性能指标分析、容量规划和截止日期分配方面。本文提出了一种用于半导体塑料球栅阵列(PBGA)封装工厂周期时间估计的统计方法。由于当今半导体行业竞争激烈,参与PBGA封装工厂的计划人员需要一种方法来获得不同置信度的估计周期时间,以确保更准确地分配到期日。因此,本文也给出了不同置信系数下估计周期时间的上置信界限。我们通过展示位于台湾新竹科技工业园区的半导体封装工厂的PBGA封装车间的实际示例来证明所提出的周期时间估计模型的适用性,该模型包含了上置信区间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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