{"title":"Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers","authors":"Yunheng Sun, Yufeng Jin, Tingting Lian, Shengli Ma, Yuchi Yang, Wei Wang, Liu-lin Hu, Shuwei He","doi":"10.1109/ECTC32862.2020.00347","DOIUrl":null,"url":null,"abstract":"In this study, we present a Q-band patch antenna with an underling cavity integrated on the stacked high-resistivity Si interposers. A process is developed and sample is fabricated. Evaluation is done and the measurement results shows that it has an operating frequency of 32.75GHz, a –10dB bandwidth of 1.04GHz, a maximum gain of 3dB. Those results prove the feasibility of integrating high-frequency antennas with TSV interposer preliminary.","PeriodicalId":6722,"journal":{"name":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","volume":"10 1","pages":"2230-2235"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC32862.2020.00347","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In this study, we present a Q-band patch antenna with an underling cavity integrated on the stacked high-resistivity Si interposers. A process is developed and sample is fabricated. Evaluation is done and the measurement results shows that it has an operating frequency of 32.75GHz, a –10dB bandwidth of 1.04GHz, a maximum gain of 3dB. Those results prove the feasibility of integrating high-frequency antennas with TSV interposer preliminary.