J. Cui, Mengxia Liu, Haibing Yang, Dong Li, Qiancheng Zhao
{"title":"Temperature Robust Silicon Resonant Accelerometer with Stress Isolation Frame Mounted on Axis-Symmetrical Anchors","authors":"J. Cui, Mengxia Liu, Haibing Yang, Dong Li, Qiancheng Zhao","doi":"10.1109/MEMS46641.2020.9056157","DOIUrl":null,"url":null,"abstract":"This paper presents a novel silicon resonant accelerometer (SRA) with a stress isolation frame mounted on axis-symmetrical anchors to improve the temperature performance. The stress-insensitive design prevents the thermal stress produced by the mismatch of the thermal expansion coefficients (CTE) of the heterogeneous materials in the device from transmitting to double-ended tuning forks (DETF), resulting in reducing the thermal sensitivity of SRA. The results show the scale factor is 516 Hz/g and the average nominal frequency of the two DETFs is ∼138.4 kHz with the closely matched temperature coefficients of frequency (TCF) 5.72 Hz/°C and 5.92 Hz/ °C, respectively. The bias thermal sensitivity and compensated stability are 0.42 mg/°C and 0.6 mg over the temperature range from −40 °C to 40 °C, which is competitive compared with previously reported results in literatures.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"10 1","pages":"791-794"},"PeriodicalIF":0.0000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMS46641.2020.9056157","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
This paper presents a novel silicon resonant accelerometer (SRA) with a stress isolation frame mounted on axis-symmetrical anchors to improve the temperature performance. The stress-insensitive design prevents the thermal stress produced by the mismatch of the thermal expansion coefficients (CTE) of the heterogeneous materials in the device from transmitting to double-ended tuning forks (DETF), resulting in reducing the thermal sensitivity of SRA. The results show the scale factor is 516 Hz/g and the average nominal frequency of the two DETFs is ∼138.4 kHz with the closely matched temperature coefficients of frequency (TCF) 5.72 Hz/°C and 5.92 Hz/ °C, respectively. The bias thermal sensitivity and compensated stability are 0.42 mg/°C and 0.6 mg over the temperature range from −40 °C to 40 °C, which is competitive compared with previously reported results in literatures.