Imprint-Through Mold Via (i-TMV) with High Aspect Ratio and Narrow Pitch for Antenna in Package

Abstract

The imprint-Through Mold Via was proposed for electromagnetic interference (EMI) shielding of Antenna in Package (AiP) application. The 300 μm-height via array could be successfully imprinted by using the silicon master which has 743 pillars with the diameter of 100 μm, pitch of 200 μm and height of 370 μm, and the via array was well filled by vacuum printing method with newly developed conductive paste utilizing transient liquid phase sintering. In order to evaluate the electric characteristics of the via array, a daisy-chain test vehicle (TV) which could connect all the vias together was fabricated. In the result of the reliability test, no electrical failure was confirmed of this daisy-chain.