Direct plated copper technology for high brightness LED packaging

Abstract

Direct Plated Copper (DPC) on ceramic substrate is a patented process by Tong Hsing that has been utilized as an outstanding solution for high brightness LED (HBLED) assembly for over ten years. DPC substrate offers several key attributes such as good TCE match to semiconductor materials, high thermal conductivity, low electrical resistance conductor traces, good reliable at high temperatures (>340°C), precise features, and ease of large format assembly. In additions, this ceramic solution also achieves fine line resolution allowing high density of devices and circuitry, proven reliability, mechanically rugged ceramic construction, and reasonable cost. DPC is implanted with seed layers on aluminum nitride (AlN) or alumina (Al2O3) by sputtering. Then photolithographic procedures are utilized to develop the circuit pattern. Then Cu and Ni layers are plated on top of seed layers to form a solid structure for circuitry. Based on ceramic and thick copper construction, the DPC substrate provides outstanding thermal and electrical performance for applications in high power or high current devices.