The reliability study of sub 100 microns SnAg flip chip solder bump on FR4 substrate under thermal cycling

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4607148

Xiaoqin Lin, L. Luo

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引用次数: 3

Abstract

Due to the advantages of small-footprint, short-lead, high performance, high-packaging-density and thin profile, flip-chip-on-board (FCOB) technology is becoming an attractive choice in todaypsilas high density electronic packaging industry. With the trend toward lead-free and miniaturization in consumer electronics, the fatigue reliability of the small size lead-free FC solder joint on low cost PCB substrate are becoming one of the important issues. In this study, the reliability of sub 100 microns Sn-3.0Ag flip chip solder bump on FR4 substrate was investigated under thermal cycling between -40degC to 125degC. The influences of the shape of solder joint on the failed plane and the fatigue life were studied. The failed plane of the solder joint was discussed by the stress state analysis of the solder joint. Using the metallography, SEM, and live testing of the resistance, failure character and failure mechanism of the solder joint before and after underfilling were analyzed. The increasement of the fatigue life with the use of underfill was interpreted by plastic mechanics.

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热循环条件下FR4衬底上亚100微米SnAg倒装片焊点的可靠性研究

由于板上倒装芯片(FCOB)技术具有占地面积小、引线短、性能优异、封装密度高、外形轻薄等优点，正成为当今高密度电子封装行业的一个有吸引力的选择。随着消费类电子产品的无铅化和小型化趋势，低成本PCB基板上小尺寸无铅FC焊点的疲劳可靠性成为重要问题之一。在本研究中，研究了FR4衬底上亚100微米Sn-3.0Ag倒装芯片焊料凸点在-40℃至125℃热循环下的可靠性。研究了焊点形状对失效面及疲劳寿命的影响。通过对焊点的应力状态分析，探讨了焊点的失效面。通过金相、扫描电镜和现场电阻测试，分析了欠填充前后焊点的破坏特征和破坏机理。用塑性力学解释了下填土对疲劳寿命的提高。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2008 International Conference on Electronic Packaging Technology & High Density Packaging

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