A Semi-Hemispherical High Q-Factor Resonators Fabricated using a Hybrid Rigid-Flex Process

Vincens Gjokaj, P. Chahal
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引用次数: 2

Abstract

In this paper, a 3D printed high-Q semihemispherical resonator fed by a coax-like transmission line is demonstrated. The semi hemispherical resonator was fabricated using polyjet printing followed by blanket metalization. It is coupled to a two-part coax-like transmission line using a slot in the 3D printed structure. The coax-like structure is fabricated using a hybrid process, combining 3D printing and fine line patterning using microlithography. Unloaded Q-factor of >8000 is measured near 44 GHz. This work shows that a 3D printed high-Q resonator can readily be coupled with microfabricated circuits on a printed circuit board or a flex substrate. Details of design, fabrication, and measurements are presented, and the measured and simulation results match closely.
半半球形高q因子谐振器的刚性-柔性混合工艺制备
本文介绍了一种采用同轴线馈电的3D打印高q半球形谐振器。采用聚合喷墨打印和包层金属化法制备了半球形谐振腔。它使用3D打印结构中的插槽耦合到两部分同轴状传输线上。同轴状结构是使用混合工艺制造的,结合了3D打印和使用微光刻技术的细线图案。在44 GHz附近测量到的卸载q因子>8000。这项工作表明,3D打印的高q谐振器可以很容易地与印刷电路板或柔性基板上的微制造电路耦合。介绍了设计、制造和测量的细节,测量结果与仿真结果非常吻合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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