Spectrum response analysis for PCB with heating ICs in different heating conditions

Bor-Tsuen Wang, Yau-Chang Lee, Y. Lai, Chang-Lin Yeh, Ying-Chih Lee
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Abstract

Coupling effects of both thermal and vibration loadings on printed circuit board (PCB) are of interest. This paper aims to study the random vibration excitation of PCB with four heating ICs that are used to emulate the temperature elevation during operations. Two levels of heating conditions as well as without heating are considered in this work. The vibration tests according to JESD22-B103-B are carried out to measure the random vibration response of PCB under the conditions of both with and without heating. The finite element (FE) model of PCB with heating ICs is constructed and performed spectrum response analysis with and without thermal effects. The temperature distributions on PCB are first verified and shown good agreement between finite element analysis (FEA) and experiments. The power spectral density (PSD) functions of the acceleration on the PCB in heating are also obtained and compared for both FEA and experiments. The RMS accelerations on the PCB can be calculated and matched well between the analytical and experimental results. The fatigue evaluation due to coupling loadings from thermal and vibration effects on the PCB is also addressed. This work presents the systematic approaches in studying spectrum response analysis of PCB with both thermal and vibration coupling loads and shows a very good agreement results between FEA and experiments.
加热集成电路PCB在不同加热条件下的频谱响应分析
热载荷和振动载荷对印刷电路板(PCB)的耦合效应令人感兴趣。本文的目的是研究用四个加热集成电路模拟PCB运行过程中温度升高的随机振动激励。在这项工作中考虑了两种加热条件以及不加热条件。根据JESD22-B103-B进行了振动测试,测量了PCB在加热和不加热条件下的随机振动响应。建立了带加热集成电路的PCB的有限元模型,并进行了有热效应和无热效应的谱响应分析。首先对PCB板上的温度分布进行了验证,有限元分析结果与实验结果吻合较好。得到了加热过程中加速度对PCB的功率谱密度(PSD)函数,并进行了有限元分析和实验比较。分析结果与实验结果吻合较好,可以计算出PCB上的均方根加速度。由于热和振动耦合载荷对PCB的疲劳评估也被解决。本文提出了一种系统的方法来研究PCB在热耦合和振动耦合载荷下的频谱响应分析,并表明有限元分析结果与实验结果吻合得很好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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