Y. Onishi, Ryunosuke Yamashita, K. Amaya, Y. Hirai
{"title":"Numerical analysis of pattern shape deformation in UV imprint considering thermal deformation with UV shrinkage and curing","authors":"Y. Onishi, Ryunosuke Yamashita, K. Amaya, Y. Hirai","doi":"10.1116/6.0000817","DOIUrl":null,"url":null,"abstract":"A novel numerical method for analyzing the deformation of molding patterns on UV imprint with soft molds considering thermal deformation in addition to UV shrinkage and curing is presented. In the case of UV imprint using an easily deformable mold-like PDMS, transfer error on UV resin is caused by thermal expansion/contraction arising from UV reaction heat and by UV shrinkage. Specifically, when a UV resin with high reaction heat such as cation polymerization-type UV resin is used, thermal deformation has a nonnegligible effect on pattern shape deformation. Therefore, it is necessary to consider thermal deformation caused by UV reaction heat in the numerical deformation analysis of UV imprint requiring high surface accuracy, such as optical devices. The present method newly adopts the theory of reaction rate to consider the temperature-dependent UV reaction rate and introduces an advanced idea of virtual temperature as a measure of UV reaction progress. By defining the time histories of thermal deformation and UV shrinkage as a function of virtual temperature, the effects of both are considered simultaneously. In order to apply the present method to actual imprints, temperature measurement experiments and various rheometry experiments are conducted on a target UV resin to identify its model parameters. A validation analysis of the present method is performed on an actual micromirror array imprint and shows that the simulation accuracy of transfer error can be significantly improved by considering thermal deformation.","PeriodicalId":17495,"journal":{"name":"Journal of Vacuum Science & Technology B","volume":"38 1","pages":"024002"},"PeriodicalIF":1.4000,"publicationDate":"2021-02-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Vacuum Science & Technology B","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1116/6.0000817","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A novel numerical method for analyzing the deformation of molding patterns on UV imprint with soft molds considering thermal deformation in addition to UV shrinkage and curing is presented. In the case of UV imprint using an easily deformable mold-like PDMS, transfer error on UV resin is caused by thermal expansion/contraction arising from UV reaction heat and by UV shrinkage. Specifically, when a UV resin with high reaction heat such as cation polymerization-type UV resin is used, thermal deformation has a nonnegligible effect on pattern shape deformation. Therefore, it is necessary to consider thermal deformation caused by UV reaction heat in the numerical deformation analysis of UV imprint requiring high surface accuracy, such as optical devices. The present method newly adopts the theory of reaction rate to consider the temperature-dependent UV reaction rate and introduces an advanced idea of virtual temperature as a measure of UV reaction progress. By defining the time histories of thermal deformation and UV shrinkage as a function of virtual temperature, the effects of both are considered simultaneously. In order to apply the present method to actual imprints, temperature measurement experiments and various rheometry experiments are conducted on a target UV resin to identify its model parameters. A validation analysis of the present method is performed on an actual micromirror array imprint and shows that the simulation accuracy of transfer error can be significantly improved by considering thermal deformation.
期刊介绍:
Journal of Vacuum Science & Technology B emphasizes processing, measurement and phenomena associated with micrometer and nanometer structures and devices. Processing may include vacuum processing, plasma processing and microlithography among others, while measurement refers to a wide range of materials and device characterization methods for understanding the physics and chemistry of submicron and nanometer structures and devices.