{"title":"Compact model for solder bump electromigration failure","authors":"H. Ceric, S. Selberherr","doi":"10.1109/IITC-MAM.2015.7325651","DOIUrl":null,"url":null,"abstract":"The mechanical and electrical properties of solder bumps influence the overall reliability of 3D ICs. In this paper we present a compact model for prediction of the mean-time-to-failure of solder bumps under the influence of electromigration.","PeriodicalId":6514,"journal":{"name":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","volume":"11 1","pages":"159-162"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC-MAM.2015.7325651","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The mechanical and electrical properties of solder bumps influence the overall reliability of 3D ICs. In this paper we present a compact model for prediction of the mean-time-to-failure of solder bumps under the influence of electromigration.