Apparent size effects on dopant activation in nanometer-wide Si fins

IF 1.4 4区 工程技术
S. Folkersma, J. Bogdanowicz, P. Favia, L. Wouters, D. H. Petersen, O. Hansen, H. H. Henrichsen, Peter Former Nielsen, L. Shiv, W. Vandervorst
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引用次数: 1

Abstract

Due to the dramatic downscaling of device features in recent technology nodes, characterizing the electrical properties of these structures is becoming ever more challenging as it often requires metrology able to probe local variations in dopant and carrier concentration with high accuracy. As no existing technique is able to meet all requirements, a correlative metrology approach is generally considered a solution. In this article, we study size-dependent effects on the dopant activation in nanometer-wide Si fins using a novel correlative approach. We start by showing that the micro four-point probe technique can be used to precisely measure the resistance of B doped and (laser) annealed Si fins. Next, we use transmission electron microscopy and scanning spreading resistance microscopy to show that the observed width dependence of the apparent sheet resistance of these fins can be explained by either a partially or a fully inactive region forming along the top of the fin sidewalls according to the annealing conditions.
粒径对掺杂剂在纳米宽硅片中活化的影响
由于在最近的技术节点中设备特征的急剧缩小,表征这些结构的电性能变得越来越具有挑战性,因为它通常需要能够高精度地探测掺杂剂和载流子浓度的局部变化的计量方法。由于没有现有的技术能够满足所有的要求,相关的计量方法通常被认为是一种解决方案。在本文中,我们使用一种新的相关方法研究了纳米宽硅片中掺杂剂激活的尺寸依赖性影响。我们首先展示了微型四点探针技术可以用于精确测量B掺杂和(激光)退火硅片的电阻。接下来,我们使用透射电子显微镜和扫描扩展电阻显微镜来表明,观察到的这些鳍片表观片电阻的宽度依赖性可以解释为根据退火条件沿鳍片侧壁顶部形成部分或完全非活性区域。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Vacuum Science & Technology B
Journal of Vacuum Science & Technology B 工程技术-工程:电子与电气
自引率
14.30%
发文量
0
审稿时长
2.5 months
期刊介绍: Journal of Vacuum Science & Technology B emphasizes processing, measurement and phenomena associated with micrometer and nanometer structures and devices. Processing may include vacuum processing, plasma processing and microlithography among others, while measurement refers to a wide range of materials and device characterization methods for understanding the physics and chemistry of submicron and nanometer structures and devices.
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