Antenna on Silicon Interconnect Fabric

A. Dasgupta, A. Alam, Guangqi Ouyang, SivaChandra Jangam, S. Iyer
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Abstract

In this paper we demonstrate a 20 GHz patch antenna on the Silicon-Interconnect Fabric (Si-IF) platform. Two methodologies to integrate the antenna are explored in this paper. One is to embed a Fused Silica die inside a recess etched on the Si-IF. The second method is to compression mold Polydimethylsiloxane (PDMS) into the Si-IF recess. The antennas fabricated with both the methods are compatible with Ground- Signal-Ground (GSG) probing, and interfacing with off the shelf MMIC dies. Along with the process flow, we also present experimental characterisation of the fabricated antennas.
硅互连结构天线
在本文中,我们展示了一个20 GHz贴片天线在硅互连结构(Si-IF)平台上。本文探讨了两种集成天线的方法。一种方法是在硅中箔上蚀刻的凹槽内嵌入熔融二氧化硅模具。第二种方法是将模具聚二甲基硅氧烷(PDMS)压缩到Si-IF凹槽中。用这两种方法制作的天线都兼容地-信号-地(GSG)探测,并与现成的MMIC芯片接口。随着工艺流程的发展,我们也给出了制作天线的实验表征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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