Chi-Hao Chiang, Thomas Wang, Shu-Ting Yang, Pao-Nan Lee, Wei-Yu Nien, CT Lee, Sidney Huang, Harrison Chang
{"title":"Embedded Power Inductor in Organic Substrate with Novel Magnetic Epoxy","authors":"Chi-Hao Chiang, Thomas Wang, Shu-Ting Yang, Pao-Nan Lee, Wei-Yu Nien, CT Lee, Sidney Huang, Harrison Chang","doi":"10.1109/ectc32862.2020.00246","DOIUrl":null,"url":null,"abstract":"The high power computing for AI and Data Centers are advancing rapidly and power efficiency becomes critical. Ways of power integration are being explored, with inductor being one of the most challenging topics. Embedding inductor in organic substrate with magnetic material is a popular approach, for the benefit of lower cost, good scalability, and future integrating roadmap. Modeling of power inductors is studied, and comparison between measurement and simulation are used to validate the modeling and verify predictions. By studying various conductor geometry and magnetic material location, an optimized inductor design approach is shown. Novel magnetic epoxy material is chosen with lamination process introduced. It is found that embedded power inductor with high inductance per area can be implemented the methods described in this paper, and a co-design approach can be used to design the power electronics using the embedded inductor with magnetic material. [1]","PeriodicalId":6722,"journal":{"name":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","volume":"22 1","pages":"1566-1572"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc32862.2020.00246","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The high power computing for AI and Data Centers are advancing rapidly and power efficiency becomes critical. Ways of power integration are being explored, with inductor being one of the most challenging topics. Embedding inductor in organic substrate with magnetic material is a popular approach, for the benefit of lower cost, good scalability, and future integrating roadmap. Modeling of power inductors is studied, and comparison between measurement and simulation are used to validate the modeling and verify predictions. By studying various conductor geometry and magnetic material location, an optimized inductor design approach is shown. Novel magnetic epoxy material is chosen with lamination process introduced. It is found that embedded power inductor with high inductance per area can be implemented the methods described in this paper, and a co-design approach can be used to design the power electronics using the embedded inductor with magnetic material. [1]